共 38 条
[21]
Pieters P., 1999, International Journal of Microcircuits and Electronic Packaging, V22, P280
[23]
Integration of passive components for microwave filters in MCM-D
[J].
1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS,
1997,
:357-362
[24]
PRANJOTO H, 1990, P EL PACK MAT SCI S, P295
[25]
Integrated and integral passive components: A technology roadmap
[J].
47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS,
1997,
:713-723
[26]
ROBERTSON ID, 1995, IEE CIRCUITS SYSTEMS, V7
[27]
ROYAL R, 1989, MONOLITHIC MICROWAVE, P375
[28]
CU PHOTOSENSITIVE-BCB THIN-FILM MULTILAYER TECHNOLOGY FOR HIGH-PERFORMANCE MULTICHIP MODULES
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
1995, 18 (01)
:18-22
[30]
Soliman EA, 1998, MICROW OPT TECHN LET, V19, P360, DOI 10.1002/(SICI)1098-2760(19981205)19:5<360::AID-MOP15>3.0.CO