Polysiloxane based flexible electrical-optical-circuits-board

被引:12
作者
Cai, D. K. [1 ]
Neyer, A. [1 ]
机构
[1] Tech Univ Dortmund, Fak Elektrotech & Informat Tech, Arbeitsgebiet Mikrostrukturtech AG MST, D-44227 Dortmund, Germany
关键词
Polysiloxane; Waveguide; Electrical-optical-circuits-board; Packaging and environmental stability; ADHESION;
D O I
10.1016/j.mee.2010.02.014
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In the paper, a packaging technique of polysiloxane based flexible electrical-optical-circuits-board (EOCB) with Kapton (Dupont) foils was developed and introduced. The main mechanism of forming a good bonding between polysiloxane and Kapton foil was identified and verified. The optical and mechanical properties of the polysiloxane waveguide layer remained unchanged before and after packaging. According to the defined procedures, the environmental stability of packaged EOCBs has been tested with the result that they exhibited excellent mechanical, optical, and thermal stabilities. The mechanical stability limit of the tested EOCBs is determined only by the intrinsic mechanical stability of the used polysiloxane materials. The optical waveguide propagation loss at 850 nm is less than 0.1 dB/cm after surviving from the defined environmental test procedures. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved.
引用
收藏
页码:2268 / 2274
页数:7
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