共 9 条
[1]
Influence of ceramic surface treatment on peel-off strength between aluminum nitride and epoxy-modified polyaminobismaleimide adhesive
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
2001, 24 (01)
:104-112
[2]
Cai D. K., 2008, THESIS DORTMUND U TE
[4]
Study on surface tension and adhesion in electronic packaging
[J].
50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS,
2000,
:586-591
[5]
Neyer A, 2005, ELEC COMP C, P246
[9]
SZETSEN L, 2004, J VAC SCI TECHNOL B, V18, P805