Mechanics of Epidermal Electronics

被引：165

作者：

Wang, Shuodao ^{[1
]}

Li, Ming ^{[2
,3
]}

Wu, Jian ^{[4
]}

Kim, Dae-Hyeong ^{[5
]}

Lu, Nanshu ^{[6
]}

Su, Yewang ^{[2
]}

Kang, Zhan ^{[3
]}

Huang, Yonggang ^{[1
,2
]}

Rogers, John A. ^{[7
,8
]}

机构：

[1] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA

[2] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA

[3] Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dalian 116024, Peoples R China

[4] Tsinghua Univ, Dept Engn Mech, Beijing 100084, Peoples R China

[5] Seoul Natl Univ, Sch Chem & Biol Engn, Seoul 151744, South Korea

[6] Univ Texas Austin, Dept Aerosp Engn & Engn Mech, Austin, TX 78705 USA

[7] Univ Illinois, Dept Mat Sci & Engn, Beckman Inst Adv Sci & Technol, Urbana, IL 61801 USA

[8] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA

来源：

JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME | 2012年 / 79卷 / 03期

基金：

美国国家科学基金会;

关键词：

work of adhesion; interfacial contact; epidermis; electronics; PRESSURE; SENSORS; STAMP; SKIN;

D O I：

10.1115/1.4005963

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der Waals interactions alone, yet provides robust, intimate contact to the skin. Recent advances on this technology will enable many medical applications such as to monitor brain or heart activities, to monitor premature babies, to enhance the control of prosthetics, or to realize human-machine interface. In particular, the contact between EES and the skin is key to high-performance functioning of the above applications and is studied in this paper. The mechanics concepts that lead to successful designs of EES are also discussed. The results, validated by finite element analysis and experimental observations, provide simple, analytical guidelines for design and optimization of EES with various possible functionalities. [DOI: 10.1115/1.4005963]

引用

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