Technology for the high-volume manufacturing of integrated surface-micromachined accelerometer products

被引：35

作者：

Chau, KHL ^{[1
]}

Sulouff, RE ^{[1
]}

机构：

[1] Analog Devices Inc, Micromachined Prod Div, Cambridge, MA 02139 USA

来源：

MICROELECTRONICS JOURNAL | 1998年 / 29卷 / 09期

关键词：

accelerometers; integrated sensors; capacitive sensors; surface micromachining; micro-electro-mechanical systems; MEMS;

D O I：

10.1016/S0026-2692(98)00021-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Since the inception of silicon surface micromachining more than fifteen years ago, the technology has successfully emerged from academic research and has found practical applications in many high-volume sensor products. The integration of on-chip electronics, in particular, represents the highest level of technological accomplishment to date in surface micromachining technology. The integrated approach offers tremendous performance enhancements while presenting numerous challenges to actual production implementation. This paper uses the Analog Devices accelerometer product series as an example to review the integrated surface micromachining technology and the practical solutions to overcome many of its challenges for high-volume manufacturing. (C) 1998 Elsevier Science Ltd. All rights reserved.

引用

页码：579 / 586

页数：8

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