MEM relay for reconfigurable RF circuits

被引：115

作者：

Mihailovich, RE ^{[1
]}

Kim, M

Hacker, JB

Sovero, EA

Studer, J

Higgins, JA

DeNatale, JE

机构：

[1] Rockwell Int Sci Ctr, Thousand Oaks, CA 91358 USA

[2] Rockwell Int Sci Ctr, Thousand Oaks, CA 91360 USA

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2001年 / 11卷 / 02期

关键词：

broadband; MEM; reconfigurable; relay; reliability;

D O I：

10.1109/7260.914300

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We describe a microelectromechanical (MEM) relay technology for high-performance reconfigurable RF circuits. This microrelay, fabricated using surface micromachining, is a metal contact relay with electrical isolation between signal and drive lines. This relay provides excellent switching performance over a broad frequency band (insertion loss of 0.1 dB and isolation of 30 dB at 40 GHz), versatility in switch circuit configurations (microstrip and coplanar, shunt and series), and the capability for monolithic integration with high-frequency electronics. In addition, this MEM relay technology has demonstrated yields and lifetimes that are promising for RF circuit implementation.

引用

页码：53 / 55

页数：3

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