On the ductile machining of silicon for micro electro-mechanical systems (MEMS), opto-electronic and optical applications

被引：137

作者：

Yan, J ^{[1
]}

Yoshino, M ^{[1
]}

Kuriagawa, T ^{[1
]}

Shirakashi, T ^{[1
]}

Syoji, K ^{[1
]}

Komanduri, R ^{[1
]}

机构：

[1] Oklahoma State Univ, Sch Mech & Aerosp Engn, Stillwater, OK 74078 USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2001年 / 297卷 / 1-2期

基金：

美国国家科学基金会;

关键词：

silicon; ductile machining; ultra-precision machining; hydrostatic pressure;

D O I：

10.1016/S0921-5093(00)01031-5

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The role of hydrostatic pressure in the ductile machining of silicon is demonstrated experimentally using a single crystal diamond tool with a large negative rake (-40 degrees) and a high side cutting edge angle (SCEA) (similar to 88 degrees) and undeformed chip thickness in the nanometric range (similar to 50 nm) using an ultraprecision machine tool and a special machining stage inside a high external hydrostatic pressure (similar to 400 MPa) apparatus. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：230 / 234

页数：5

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