Electromigration induced metal dissolution in flip-chip solder joints

被引：4

作者：

Lin, YH ^{[1
]}

Tsai, CM ^{[1
]}

Hu, YC ^{[1
]}

Lin, YL ^{[1
]}

Tsai, JY ^{[1
]}

Kao, CR ^{[1
]}

机构：

[1] Natl Cent Univ, Dept Chem & Mat Engn, Chungli 32054, Taiwan

来源：

PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 | 2005年 / 475-479卷

关键词：

electromigration; thermomigration; solder; flip-chip;

D O I：

10.4028/www.scientific.net/MSF.475-479.2655

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The failure of flip chip solder joints through the dissolution of the Cu metallization was studied. From the location and geometry of the dissolved Cu, it can be concluded that current crowding played a critical role in the dissolution. It can also be concluded that temperature, as an experimental variable, is not less import than the current density in electromigration study. Experimentally, no evidence of mass transport due to thermomigration was observed.

引用

页码：2655 / 2658

页数：4

共 6 条

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