Neural-network-based sensor fusion of optical emission and mass spectroscopy data for real-time fault detection in reactive ion etching

被引:35
作者
Hong, SJ [1 ]
May, GS [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
基金
美国国家科学基金会;
关键词
neural networks (NNs); optical emission spectroscopy (OES); reactive ion etching (RIE); real-time fault detection; residual gas analysis (RGA); sensor fusion; time series modeling;
D O I
10.1109/TIE.2005.851663
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
To achieve timely and accurate fault detection in reactive ion etching, neural networks (NNs) have been applied for the fusion of data generated by two in-situ sensors: optical emission spectroscopy (OES) and residual gas analysis (RGA). While etching is performed, OES and RGA data are simultaneously collected in real time. Several pre-determined, statistically significant wavelengths (for OES data) and atomic masses (for RGA signals) are monitored. These data are subsequently used for training NN-based time series models of process behavior. Such models, referred to herein as time series NNs (TSNNs), are realized using multilayered perceptron NNs. Results indicate that the TSNNs not only predict process parameters of interest, but also efficiently perform as sensor fusion of the in-situ sensor data.
引用
收藏
页码:1063 / 1072
页数:10
相关论文
共 18 条
[1]  
Almgren C., 1997, Semiconductor International, V20, P99
[2]  
[Anonymous], 1994, NEURAL NETWORKS
[3]  
COMELLO V, 1990, SEMICOND INT SEP, P70
[4]   A MONTE-CARLO MICROTOPOGRAPHY MODEL FOR INVESTIGATING PLASMA REACTIVE ION ETCH PROFILE EVOLUTION [J].
COTLER, TJ ;
BARNES, MS ;
ELTA, ME .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (02) :542-550
[5]   2-DIMENSIONAL IMPLICATIONS OF A PURELY REACTIVE MODEL FOR PLASMA-ETCHING [J].
GERODOLLE, AF ;
PELLETIER, J .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (09) :2025-2032
[6]  
HESS D, 2003, COMMUNICATION MAR
[7]   ADVANTAGES OF PLASMA ETCH MODELING USING NEURAL NETWORKS OVER STATISTICAL TECHNIQUES [J].
HIMMEL, CD ;
MAY, GS .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1993, 6 (02) :103-111
[8]  
HONG S, 2002, P ADV SEM MAN C BOST, P631
[9]  
HONG S, 2002, SMART ENG SYSTEM DES, V12, P945
[10]  
Jollife I., 1986, Principal Component Analysis