The influence of the laser spot size and the pulse number on laser-induced backside wet etching

被引：47

作者：

Böhme, R ^{[1
]}

Zimmer, K ^{[1
]}

机构：

[1] Leibniz Inst Oberflachenmodif eV, D-04318 Leipzig, Germany

来源：

APPLIED SURFACE SCIENCE | 2005年 / 247卷 / 1-4期

关键词：

excimer laser; laser etching; pulse number; laser spot size; etch rate;

D O I：

10.1016/j.apsusc.2005.01.058

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The laser-induced backside wet etching (LIBWE) of transparent solids at the interface to absorbing liquid is a new promising method for laser microstructuring. The influence of the laser spot size and the applied pulse number to the etch rate were investigated in detail for fused silica and two different liquids. Additional to the significant rise of the etch rate with increasing spot size considerable incubation effects have been observed at low laser fluences and pulse numbers. Based on the bubble formation during LIBWE processing, a relation between the bubble collapse time and the etch rate was ascertained. This relation fits the etch rate dependence on the spot size well. It is assumed that the deposition of decomposition products from the bubble accounts for the spot size influence the etch rate. (c) 2005 Elsevier B. V. All rights reserved.

引用

页码：256 / 261

页数：6

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