Electromigration effects in Al-Au multilayers

被引：100

作者：

Bertolino, N ^{[1
]}

Garay, J

Anselmi-Tamburini, U

Munir, ZA

机构：

[1] Univ Calif Davis, Dept Chem Engn & Mat Sci, Facil Adv Combust Synth, Davis, CA 95616 USA

[2] Univ Pavia, Dept Phys Chem, Pavia, Italy

来源：

SCRIPTA MATERIALIA | 2001年 / 44卷 / 05期

基金：

美国国家科学基金会;

关键词：

electromigration; gold-aluminum; multilayers; intermetallic; compound formation;

D O I：

10.1016/S1359-6462(00)00669-2

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The electromigration effects in the system Al-Au multilayers were investigated using the solid-solid diffusion couple reactions. The presence of a current density enhances the growth process as well as the nucleation process. Electron microprobe analysis of samples annealed for 7 hours showed a significant diffusion of Al into Au, extending to a distance of about 10μm. The presence of Al in the Au layers plays an important role. Once the phase Au5Al2 has nucleated, the Al present in the Au layer contributes to an enhanced growth rate.

引用

页码：737 / 742

页数：6

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