Electrical effects of N2 plasma exposure on dry-etch damage in p- and n-GaN Schottky diodes

被引:26
作者
Kent, DG
Lee, KP
Zhang, AP
Luo, B
Overberg, ME
Abernathy, CR
Ren, F
Mackenzie, KD
Pearton, SJ
Nakagawa, Y
机构
[1] Univ Florida, Dept Chem Engn, Gainesville, FL 32611 USA
[2] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
[3] Unaxis USA Inc, St Petersburg, FL 33703 USA
[4] Nichia Chem Inst, Tokushima 89165, Japan
关键词
p- and n-GaN Schottky diodes; annealing recovery; plasma damage; chamber pressure effect; AFM surface roughness; nitridation of nitride substrate;
D O I
10.1016/S0038-1101(01)00248-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Exposure of dry-etch damaged p- and n-GaN to a N-2 plasma at elevated temperatures (175-350 degreesC) is found to produce partial recovery of the electrical properties of the near-surface region. The recovery is due to two mechanisms an annealing effect and a nitridation of the initially N-2 deficient surface. A degree of surface smoothing was also obtained with N-2 plasma exposure. The extent of the damage recovery is less than complete for both conductivity types of GaN. (C) 2001 Published by Elsevier Science Ltd.
引用
收藏
页码:1837 / 1842
页数:6
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