Effect of particle shape of silica mineral on the properties of epoxy composites

被引：110

作者：

Ahmad, Farrah Noor ^{[1
]}

Jaafar, Mariatti ^{[1
]}

Palaniandy, Samayarnutthirian ^{[1
]}

Azizli, Khairun Azizi Mohd ^{[1
]}

机构：

[1] Univ Sains Malaysia, Sch Mat & Mineral Resources Engn, Nibong Tebal 14300, Penang, Malaysia

来源：

COMPOSITES SCIENCE AND TECHNOLOGY | 2008年 / 68卷 / 02期

关键词：

strength; mechanical properties; polymer-matrix composites (PMC); particle-reinforced composites; scanning electron microscopy (SEM);

D O I：

10.1016/j.compscitech.2007.07.015

中图分类号：

TB33 [复合材料];

学科分类号：

摘要：

This study was carried out to evaluate the performance of silica mineral composites in comparison with conventional fused silica composites, which is commonly used as underfill material. The silica mineral was produced by fine grinding technique. Three different particle shape type, namely angular, cubical and elongated shapes were obtained by varying the classifier speed of the grinder. In this study, the effects of different percentage of filler loading and shapes of silica mineral particles on the mechanical and thermal properties of composite systems were investigated. In general, it was found that the addition of particulate filler loading increased the tensile strength and modulus, flexural strength and modulus, thermal stability and T-g. As expected, the addition of filler in epoxy reduced the coefficient of thermal expansion (CTE) of the system. The study showed that elongated silica mineral particles exhibited higher flexural and tensile properties and comparable CTE in comparison with fused silica filler composites. (C) 2007 Elsevier Ltd. All rights reserved.

引用

页码：346 / 353

页数：8

共 22 条

[1]

ADAMSON SJ, 2003, ELECT B HONG KONG, V6, P32

[2]

AHMAD FN, 2006, THESIS U SAINS MALAY

[3]

Bose S., 2004, Journal of Minerals Materials Characterization Engineering, V3, P23

[4] Which shape factor(s) best describe granules? [J].

Bouwman, AM ;

Bosma, JC ;

Vonk, P ;

Wesselingh, JHA ;

Frijlink, HW .

POWDER TECHNOLOGY, 2004, 146 (1-2) :66-72

[5] Thermal characterization of overmolded underfill materials for stacked chip scale packages [J].

He, Y .

THERMOCHIMICA ACTA, 2005, 433 (1-2) :98-104

[6] Curing kinetics and optimal cure schedules for underfill materials [J].

Hsu, DT ;

Kim, HK ;

Shi, FG ;

Tong, HY ;

Chungpaiboonpatana, S ;

Davidson, C ;

Adams, JM .

MICROELECTRONICS JOURNAL, 2000, 31 (04) :271-275

[7] Influences of particle size and interface energy on the stress concentration induced by the oblate spheroidal particle and the void nucleation mechanism [J].

Huang, Minsheng ;

Li, Zhenhuan .

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2006, 43 (14-15) :4097-4115

[8]

KATZ HS, 1987, HDB FILLERS PLASTICS, P3

[9] Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants [J].

Lau, JH ;

Lee, SWR ;

Chang, C ;

Ouyang, C .

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, :571-582

[10] Comparative study of thermally conductive fillers in underfill for the electronic components [J].

Lee, WS ;

Yu, J .

← 1 2 3 →