HPR 506 photoresist used as a positive tone ion resist

被引:3
作者
Bruenger, WH [1 ]
Buchmann, LM [1 ]
Torkler, M [1 ]
Sinkwitz, S [1 ]
机构
[1] OLIN MICROELECT MAT,B-2070 ZWIJNDRECHT,BELGIUM
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1996年 / 14卷 / 06期
关键词
D O I
10.1116/1.588696
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A positive tone photo resist HPR 506 (Olin Microelectronic Materials) has been investigated for its performance under ion exposure. Experiments have been conducted with light ions (H+ and He+) in the ion projector IPLM 02 (IMS; Vienna) at an energy of 75 keV. The resist resolution proved to be similar to 180 nm which is not as good as the projector resolution of below 80 nm as demonstrated with Polymethylmetacrylate. The sensitivity of HPR 506 resist in positive tone amounts to 1.2 x 10(13) H+ ions/cm(2) and 6 x 10(12) He+ ions/cm(2) with contrast numbers of 3.3 and 3.2, respectively. The dose gap between positive and negative mode is sufficiently high (factor of 3) to guarantee a good process stability. The exposure latitude for He+ exposure has a value of 15 nm. The sensitivity does not oscillate with resist thickness like in optical lithography. These performance data confirm that HPR 506 resist can be used for mix and match exposure in ion projectors and i-line steppers. (C) 1996 American Vacuum Society.
引用
收藏
页码:3924 / 3927
页数:4
相关论文
共 10 条
  • [1] BRUENGER WH, 1995, J VAC SCI TECHNOL B, V13, P2561
  • [2] BRUENGER WH, 1994, J VAC SCI TECHNOL B, V12, P3547
  • [3] Buchmann L.-M., 1992, Journal of Microelectromechanical Systems, V1, P116, DOI 10.1109/84.186390
  • [4] DUBNER AD, 1992, J VAC SCI TECHNOL B, V12, P3212
  • [5] EXPERIMENTAL INVESTIGATION OF STOCHASTIC SPACE-CHARGE EFFECTS ON PATTERN RESOLUTION IN ION PROJECTION LITHOGRAPHY SYSTEMS
    HAMMEL, E
    CHALUPKA, A
    FEGERL, J
    FISCHER, R
    LAMMER, G
    LOSCHNER, H
    MALEK, L
    NOWAK, R
    STENGL, G
    VONACH, H
    WOLF, P
    BRUNGER, WH
    BUCHMANN, LM
    TORKLER, M
    CEKAN, E
    FALLMANN, W
    PASCHKE, F
    STANGL, G
    THALINGER, F
    BERRY, IL
    HARRIOTT, LR
    FINKELSTEIN, W
    HILL, RW
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06): : 3533 - 3538
  • [6] CAMP-6, A DEEP-UV POSITIVE TONE RESIST APPLIED TO E-BEAM EXPOSURE
    HINTERMAIER, M
    ANZINGER, H
    KNAPEK, E
    [J]. MICROELECTRONIC ENGINEERING, 1994, 23 (1-4) : 295 - 298
  • [7] HOFFMANN K, 1982, MICROCIRCUIT ENG, V82, P165
  • [8] ION-BEAM EXPOSURE PROFILES IN PMMA-COMPUTER SIMULATION
    KARAPIPERIS, L
    ADESIDA, I
    LEE, CA
    WOLF, ED
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (04): : 1259 - 1263
  • [9] Loschner H., 1994, Microlithography World, V3, P4
  • [10] STANGL G, COMMUNICATION