Plasma deposition of silver nanoparticles onto stainless steel for the prevention of fungal biofilms:: A case study on Saccharomyces cerevisiae

被引：34

作者：

Guillemot, Gaelle ^{[1
]}

Despax, Bernard ^{[2
]}

Raynaud, Patrice ^{[1
,2
]}

Zanna, Sandrine ^{[3
]}

Marcus, Philippe ^{[3
]}

Schmitz, Philippe

Mercier-Bonin, Muriel ^{[1
]}

机构：

[1] INRA, CNRS, UMR5504, UMR792 Ingn Syst Biol & Procedes, F-31400 Toulouse, France

[2] Univ Toulouse 3, Lab Plasma & Convers Energie, UMR CNRS 5213, F-31062 Toulouse 9, France

[3] Ecole Natl Super Chim Paris, UMR CNRS 7045, Lab Physicochim Surfaces, F-75005 Paris, France

来源：

PLASMA PROCESSES AND POLYMERS | 2008年 / 5卷 / 03期

关键词：

cold plasmas; shear-flow detachment; silver nanocomposites; stainless steel; yeast adhesion;

D O I：

10.1002/ppap.200700088

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A silver nanoparticle composite film was deposited onto stainless steel to reduce the adhesion strength of the model yeast S. cerevisiae. Deposition was carried out under cold-plasma conditions, combining RF glow discharge and silver sputtering. Shear-flow-induced detachment experiments demonstrated the film's anti-adhesive properties. However, the surface tended to undergo some chemical changes after use, such an increase in hydrophilicity. XPS analysis confirmed the presence of metallic silver for the native plasma-modified surface and revealed silver oxidation after use. The silver content was also lowered, due to the progressive release of ionic silver from the composite into the medium.

引用

页码：228 / 238

页数：11

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