Fundamental building blocks for circuits on textiles

被引:61
作者
Locher, Ivo [1 ]
Troster, Gerhard
机构
[1] ETH, Elect Lab, CH-8092 Zurich, Switzerland
[2] ETH, Wearable Comp Lab, Dept Informat Technol & Elect Engn, CH-8092 Zurich, Switzerland
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2007年 / 30卷 / 03期
关键词
interposer technology; system-on-textile; textile interconnects; textile substrates; wearable computing;
D O I
10.1109/TADVP.2007.898636
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents the necessary ingredients for a successful realization of electrical circuits on fabrics. We start with the specification of a hybrid fabric as substrate. The discussion of textile transmission lines as well as textile interconnects reveals a flat frequency response up to about 2 GHz and 600 MHz, respectively. The proposed transmission lines feature line impedances in the range of 250 Omega. A novel interposer concept is the key technology to our approach of implementing circuits on textiles. We introduce different variants of this interposer and give formulas to determine their fabric area consumption. The presented technologies allow realization and wiring of circuits on fabrics with signal frequencies up to several hundred megahertz.
引用
收藏
页码:541 / 550
页数:10
相关论文
共 28 条
[1]  
*AG TECHN, HEWL PACK HP48753E U
[2]   Modeling and characterization of the bonding-wire interconnection [J].
Alimenti, F ;
Mezzanotte, P ;
Roselli, L ;
Sorrentino, R .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2001, 49 (01) :142-150
[3]  
*ANS CORP, 2002, ANS HFSS US MAN
[4]   Characteristic impedance of unbalanced TDR probes [J].
Ball, JAR .
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2002, 51 (03) :532-536
[5]   Flexible polyimide interposer for CSP preparation [J].
Beyer, V ;
Kuchenmeister, F ;
Bottcher, M ;
Meusel, E .
3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS, 1998, :112-115
[6]  
BROWN WD, 1998, ADV ELECT PACKAGING
[7]   Electrical characterization of textile transmission lines [J].
Cottet, D ;
Grzyb, J ;
Kirstein, T ;
Tröster, G .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (02) :182-190
[8]   Woven fabric-based electrical circuits - Part II: Yarn and fabric structures to reduce crosstalk noise in woven fabric-based circuits [J].
Dhawan, A ;
Ghosh, TK ;
Seyam, AM ;
Muth, JF .
TEXTILE RESEARCH JOURNAL, 2004, 74 (11) :955-960
[9]  
Diestel R., 2000, GRAPH THEORY
[10]  
FREYMAN B, 1993, JAP I EL MAN TECHN S, P41