Fundamental building blocks for circuits on textiles

被引：61

作者：

Locher, Ivo ^{[1
]}

Troster, Gerhard

机构：

[1] ETH, Elect Lab, CH-8092 Zurich, Switzerland

[2] ETH, Wearable Comp Lab, Dept Informat Technol & Elect Engn, CH-8092 Zurich, Switzerland

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2007年 / 30卷 / 03期

关键词：

interposer technology; system-on-textile; textile interconnects; textile substrates; wearable computing;

D O I：

10.1109/TADVP.2007.898636

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents the necessary ingredients for a successful realization of electrical circuits on fabrics. We start with the specification of a hybrid fabric as substrate. The discussion of textile transmission lines as well as textile interconnects reveals a flat frequency response up to about 2 GHz and 600 MHz, respectively. The proposed transmission lines feature line impedances in the range of 250 Omega. A novel interposer concept is the key technology to our approach of implementing circuits on textiles. We introduce different variants of this interposer and give formulas to determine their fabric area consumption. The presented technologies allow realization and wiring of circuits on fabrics with signal frequencies up to several hundred megahertz.

引用

页码：541 / 550

页数：10

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