Three-dimensional integrated circuit using printed electronics

被引：61

作者：

Huebler, A. C. ^{[1
]}

Schmidt, G. C. ^{[1
]}

Kempa, H. ^{[1
]}

Reuter, K. ^{[1
]}

Hambsch, M. ^{[1
]}

Bellmann, M. ^{[1
]}

机构：

[1] Tech Univ Chemnitz, Inst Print & Media Technol, D-09107 Chemnitz, Germany

来源：

ORGANIC ELECTRONICS | 2011年 / 12卷 / 03期

关键词：

Printed electronics; Three-dimensional circuits; Organic field-effect transistors; Multilayer interconnects; SEMICONDUCTOR; INTERCONNECT;

D O I：

10.1016/j.orgel.2010.12.010

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A fully printed ring oscillator circuit is reported, which has not only horizontally arranged parts, but inverter stages stacked vertically on top of each other in four through-connected substrate layers. For the preparation of the inverters exclusively gravure and flexographic printing were used. Characteristics of the stacked ring oscillator are similar to planar circuits. A very interesting path of development for printed electronics is opened with this approach, because three-dimensional circuits become possible. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：419 / 423

页数：5

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