Thermal analysis of high power LED package with heat pipe heat sink

被引：105

作者：

Lu, Xiang-you ^{[1
,2
]}

Hua, Tse-Chao ^{[1
]}

Wang, Yan-ping ^{[2
]}

机构：

[1] Shanghai Univ Sci & Technol, Sch Power Engn, Shanghai 200093, Peoples R China

[2] Anhui Univ Architecture, Sch Power Engn, Hefei 230022, Peoples R China

来源：

MICROELECTRONICS JOURNAL | 2011年 / 42卷 / 11期

基金：

中国国家自然科学基金;

关键词：

High-power LED; Heat pipe; Thermal resistance; Junction temperature; SYSTEM;

D O I：

10.1016/j.mejo.2011.08.009

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 degrees C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system. (C) 2011 Elsevier Ltd. All rights reserved.

引用

页码：1257 / 1262

页数：6

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