A liquid metal cooling system for the thermal management of high power LEDs

被引:169
作者
Deng, Yueguang [1 ]
Liu, Jing [1 ]
机构
[1] Chinese Acad Sci, Tech Inst Phys & Chem, Key Lab Cryogen, Beijing 100190, Peoples R China
基金
中国国家自然科学基金;
关键词
Light-emitting diode (LED); Liquid metal cooling; Heat dissipation;
D O I
10.1016/j.icheatmasstransfer.2010.04.011
中图分类号
O414.1 [热力学];
学科分类号
摘要
An active cooling solution using liquid metal as the coolant was proposed for high power light emitting diodes (LEDs). The typical thermal-physical properties of liquid metal were presented. Then a series of experiments under different operation conditions were performed to evaluate the heat dissipation performance of the liquid metal cooling system, and the results were compared with that of water. In order to better understand the cooling capability of liquid metal cooling system, a theoretical thermal resistance model was established and discussed. Both the experiments and theoretical analysis indicated that liquid metal cooling was a powerful way for heat dissipation of high power LEDs, and the fabrication of practical liquid metal cooling devices was feasible and useful. (C) 2010 Elsevier Ltd. All rights reserved.
引用
收藏
页码:788 / 791
页数:4
相关论文
共 19 条
[1]   Optimal design of miniature piezoelectric fans for cooling light emitting diodes [J].
Açikalin, T ;
Garimella, SV ;
Petroski, J ;
Raman, A .
ITHERM 2004, VOL 1, 2004, :663-671
[2]  
Arik M, 2003, 3 INT C SOL STAT LIG, P64
[3]   Improved Heat-Dissipating Silicone by Nano-materials for LED Packaging [J].
Cao, M. L. ;
Pang, F. Y. ;
Zhang, M. C. ;
Cheng, Z. J. ;
Gao, Y. ;
He, P. G. ;
Pan, L. K. ;
Sun, Z. .
2008 2ND IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE, VOLS 1-3, 2008, :758-+
[4]   Study on the cooling enhancement of LED heat sources via an electrohydrodynamic approach [J].
Chau, S. W. ;
Lin, C. H. ;
Yeh, C. H. ;
Yang, C. .
IECON 2007: 33RD ANNUAL CONFERENCE OF THE IEEE INDUSTRIAL ELECTRONICS SOCIETY, VOLS 1-3, CONFERENCE PROCEEDINGS, 2007, :2934-2937
[5]  
Chen YY, 2005, J INFRARED MILLIM W, V24, P53
[6]  
Cheng T, 2008, 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, P464
[7]   Thermal management methods for compact high power LED Arrays [J].
Christensen, Adam ;
Ha, Minseok ;
Graham, Samuel .
SEVENTH INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2007, 6669
[8]  
DENG YG, 2009, 7 INT ASME C NAN MIC
[9]  
Gao S, 2008, ELEC COMP C, P798
[10]   Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management [J].
Kai, Zhang ;
Yuen, Matthew M. F. ;
Xiao, David G. W. ;
Fu, Y. Y. ;
Chan, Philip .
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, :1659-+