共 27 条
[1]
BEK R, 1997, COMMUNICATION DEC
[2]
BENTLEY JL, 1997, UNPUB ALGORITHMS KLE
[3]
Boning D. S., 1996, IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C (Manufacturing), V19, P307, DOI 10.1109/3476.558560
[4]
*CAD DES SYST INC, 1997, DRAC STAND VE REF
[5]
Implications of area-array I/O for row-based placement methodology
[J].
IEEE SYMPOSIUM ON IC/PACKAGE DESIGN INTEGRATION - PROCEEDINGS,
1998,
:93-98
[6]
CAMILLETTI LE, 1995 IEEE SEMI ADV S, P2
[7]
CAMILLETTI LE, 1998, COMMUNICATION APR
[8]
Integration of unit processes in a shallow trench isolation module for a 0.25 μm complementary metal-oxide semiconductor technology
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
1997, 15 (06)
:1936-1942
[9]
DIVECHA R, 1997, P 2 INT C CHEM MECH, P29
[10]
Glendinning W.B., 1991, HDB VLSI MICROLITHOG