Dynamic actuation of polyimide V-groove joints by electrical heating

被引:35
作者
Ebefors, T [1 ]
Kalvesten, E [1 ]
Stemme, G [1 ]
机构
[1] Royal Inst Technol, Dept Signals Sensors & Syst, SE-10044 Stockholm, Sweden
关键词
3-D silicon microstructures; polyimide joints; dynamic actuation; electrical heating;
D O I
10.1016/S0924-4247(97)01769-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
New robust three-dimensional silicon structures with integrated heaters for dynamic actuation have been fabricated and tested. The structures can be used in both static and dynamic modes for 3-D sensor and actuator applications. The proposed technique for bending 3-D structures out of the wafer plane is based on thermal shrinkage of polyimide in V-grooves, producing static bending. This static angle can be chosen in a wide range by varying the curing temperature. The relatively large thermal expansion of polyimide makes it possible to use the structure in dynamic mode. A local power dissipation in the joint is achieved by using a current through an integrated heater. This makes it possible to control the bending angle of each individual structure. For the tested polyimide V-groove joints, static bending angles of 35 degrees and dynamic angles of 3 degrees per V-groove have been achieved. (C) 1998 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:199 / 204
页数:6
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