A bakable microvalve with a Kovar-glass-silicon-glass structure

被引：31

作者：

Sim, DY

Kurabayashi, T

Esashi, M

机构：

[1] Faculty of Engineering, Tohoku University, Aramaki, Aoba-ku

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1996年 / 6卷 / 02期

关键词：

D O I：

10.1088/0960-1317/6/2/009

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new bakable pneumatic silicon microvalve has been developed by micromachining for advanced semiconductor device fabrication. This microvalve is composed of an anodically bonded glass-silicon-glass structure and it is further bonded to a Kovar alloy block which has stainless steel tubes. The gas dow rate could be controlled from 0.5 sccm to 50 sccm at an inlet pressure of 0.26 kgf cm(-2). This microvalve can be used in the temperature range from 25 to 120 degrees C.

引用

页码：266 / 271

页数：6

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