Dissolution of Cu into Sn-based solders during reflow soldering

被引：5

作者：

Lee, JH

Shin, DH

Kim, YS

机构：

[1] Hongik Univ, Dept Mat Sci & Engn, Seoul 121791, South Korea

[2] Integrated Opt Module Team, Taejon 305350, South Korea

[3] Hanyang Univ, Dept Mat Sci & Engn, Ansan 425791, South Korea

来源：

METALS AND MATERIALS INTERNATIONAL | 2003年 / 9卷 / 06期

关键词：

reflow soldering; supersaturation; channel; Cu(6)Sn(5); Sn-37Pb;

D O I：

10.1007/BF03027258

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Cu contents in pure Sn and Sn-37Pb solders were measured as a function of reflowing time. The results indicated that the contents are significantly higher than that of the Cu solubility limit in each solder. Several plausible causes for the excess dissolution of Cu into the solders were explored with experimental observations.

引用

页码：577 / 581

页数：5

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