Design and fabrication of a cross flow micro heat exchanger

被引:116
作者
Harris, C [1 ]
Despa, M [1 ]
Kelly, K [1 ]
机构
[1] Louisiana State Univ, Dept Mech Engn, Baton Rouge, LA 70803 USA
关键词
heat transfer; LIGA; MEMS; microchannel; molding; radiator;
D O I
10.1109/84.896772
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A cross flow micro heat exchanger was designed to maximize heat transfer from a liquid (water-glycol) to a gas (air) for a given frontal area while holding pressure drop across the heat exchanger of each fluid to values characteristic of conventional scale heat exchangers. The predicted performance for these plastic, ceramic, and aluminum micro heat exchangers are compared with each other and to current innovative car radiators. The cross flow micro heat exchanger can transfer more heat/volume or mass than existing heat exchangers within the context of the design constraints specified. This can be important in a wide range of applications (automotive, home heating, and aerospace). The heat exchanger was fabricated by aligning and then bonding together two identical plastic parts that had been molded using the LIGA process. After the heat exchanger was assembled, liquid was pumped through the heat exchanger, and minimal leakage was observed.
引用
收藏
页码:502 / 508
页数:7
相关论文
共 9 条
[1]  
[Anonymous], 1987, HDB SINGLE PHASE CON
[2]  
Fox R.W., 1992, Introduction to Fluid Mechanics, Vfourth
[3]   Inexpensive, quickly producable X-ray mask for LIGA [J].
Harris, C ;
Desta, Y ;
Kelly, KW ;
Calderon, G .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 1999, 5 (04) :189-193
[4]  
Incropera FrankP., 2002, INTRO HEAT TRANSFER, V4th
[5]   High performance forced air cooling scheme employing microchannel heat exchangers [J].
Kleiner, MB ;
Kuhn, SA ;
Haberger, K .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1995, 18 (04) :795-804
[6]  
PARRINO M, SAE TECH PAPER SERIE
[7]   HIGH-PERFORMANCE HEAT SINKING FOR VLSI [J].
TUCKERMAN, DB ;
PEASE, RFW .
ELECTRON DEVICE LETTERS, 1981, 2 (05) :126-129
[8]  
WEBB R, SAE TECH PAPER SERIE
[9]  
WEGENG RS, 1994, MECH ENG, P82