Analysis and design of polysilicon thermal flexure actuator

被引:265
作者
Huang, QA [1 ]
Lees, NKS [1 ]
机构
[1] Hong Kong Univ Sci & Technol, Dept Ind Engn & Engn Management, Hong Kong, Peoples R China
关键词
D O I
10.1088/0960-1317/9/1/308
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An analytical model that can accurately predict the performance of a polysilicon thermal flexure actuator has been developed. This model is based on an electrothermal analysis of the actuator, incorporating conduction heat transfer. Heat radiation from the hot arm of the actuator to the cold arm is also estimated. Results indicate that heat radiation becomes significant only at high input power, and conduction heat losses to both the substrate and the anchor are mainly responsible for the operating temperature of the actuator under routine operations. Actuator deflection is computed based on elastic analysis of structures. To verify the validity of the model, polysilicon thermal flexure actuators have been fabricated and tested. Experimental results are in good agreement with theoretical predications except at high input power. An actuator with a 240 mu m long, 2 mu m thick, 3 mu m wide hot arm and a 180 mu m long, 12 mu m wide cold arm deflected up to 12 mu m for the actuator tip at an input voltage of 5 V while it could be expected to deflect up to 22 mu m when a 210 mu m long cold arm is used.
引用
收藏
页码:64 / 70
页数:7
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