Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits

被引：95

作者：

Krishnamoorthy, AV ^{[1
]}

Chirovsky, LMF ^{[1
]}

Hobson, WS ^{[1
]}

Leibenguth, RE ^{[1
]}

Hui, SP ^{[1
]}

Zydzik, CJ ^{[1
]}

Goossen, KW ^{[1
]}

Wynn, JD ^{[1
]}

Tseng, BJ ^{[1
]}

Lopata, J ^{[1
]}

Walker, JA ^{[1
]}

Cunningham, JE ^{[1
]}

D'Asaro, LA ^{[1
]}

机构：

[1] AT&T Bell Labs, Lucent Technol, Holmdel, NJ 07733 USA

来源：

IEEE PHOTONICS TECHNOLOGY LETTERS | 1999年 / 11卷 / 01期

关键词：

CMOS integrated circuits; flip-chip devices; laser arrays; optical interconnections; quantum-well devices; smart pixels; VCSEL's;

D O I：

10.1109/68.736418

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via hip-chip bonding.

引用

页码：128 / 130

页数：3

共 23 条

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