Effects of interfacial sulfidization and thermal annealing on the electrical properties of an atomic-layer-deposited Al2O3 gate dielectric on GaAs substrate

In this study we investigated the interfacial chemistry occurring between an atomic-layer-deposited Al2O3 high-k film and a GaAs substrate and the impact of sulfidization and thermal annealing on the properties of the resultant capacitor. We observed that sulfide passivation of the Al2O3/GaAs structure improved the effect of Fermi level pinning on the electrical characteristics, thereby providing a higher oxide capacitance, smaller frequency dispersion, and reduced surface states, as well as decreased interfacial charge trapping and gate leakage currents. Photoemission analysis indicated that the (NH4)(2)S-treated GaAs improved the quality of the as-deposited Al2O3 thin film and preserved the stoichiometry of the dielectric during subsequent high-temperature annealing. This behavior was closely correlated to the diminution of GaAs native oxides and elemental arsenic defects and their unwanted diffusion. In addition, thermal processing under an O-2 atmosphere, relative to that under N-2, decreased the thickness of the Al2O3 gate dielectric and relieved the gate leakage degradation induced by metallic arsenic; as a result, superior dielectric reliability was attained. We discuss the underlying thermochemical reactions that account for these experimental observations. (C) 2008 American Institute of Physics.