Sulfur passivation of GaAs metal-semiconductor field-effect transistor

被引:47
作者
Dong, Y [1 ]
Ding, XM
Hou, XY
Li, Y
Li, XB
机构
[1] Fudan Univ, Surface Phys Lab, Shanghai 200433, Peoples R China
[2] Minist Informat Ind, Elect Res Inst 13, Shijiazhuang 050002, Peoples R China
关键词
D O I
10.1063/1.1331642
中图分类号
O59 [应用物理学];
学科分类号
摘要
A passivation technique consisting of a (NH4)(2)S dip followed by GaS deposition has been applied to a GaAs microwave-power metal-semiconductor field-effect transistor (MESFET). The breakdown characteristic of the MESFET is greatly improved upon the (NH4)(2)S treatment, and a stable passivation effect can be achieved by GaS film deposition. It is found that the FET current-voltage characteristics are closely related to variations in the pinning position of the GaAs surface Fermi level. With the surface passivated, a depletion layer can be properly formed and protected, which is of benefit to the control of the device parameters. (C) 2000 American Institute of Physics. [S0003-6951(00)04150-4].
引用
收藏
页码:3839 / 3841
页数:3
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