Controlling the thickness of the surface oxide layer on Cu nanoparticles for the fabrication of conductive structures by ink-jet printing

被引:474
作者
Jeong, Sunho [2 ]
Woo, Kyoohee [2 ]
Kim, Dongjo [2 ]
Lim, Soonkwon [3 ]
Kim, Jang Sub [3 ]
Shin, Hyunjung [4 ]
Xia, Younan [1 ,5 ]
Moon, Jooho [2 ]
机构
[1] Washington Univ, Dept Biomed Engn, St Louis, MO 63130 USA
[2] Yonsei Univ, Dept Mat Sci & Engn, Seoul 120749, South Korea
[3] Samsung Elect Co LTD, LCD R&D Ctr, Gyeonggi Do 449711, South Korea
[4] Kookmin Univ, Sch Adv Mat Engn, Seoul 136702, South Korea
[5] Univ Washington, Dept Chem, Seattle, WA 98195 USA
关键词
D O I
10.1002/adfm.200700902
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
With the aim of preparing a high performance conductive ink, we sought to control the surface chemistry of Cu nanoparticles so as to minimize surface oxidation. Specifically, the surface oxide layer on Cu nanoparticles synthesized in ambient atmosphere was minimized by adjusting the molecular weight of poly(N-vinylpyrrolidone) capping molecules, as confirmed by high resolution transmission electron microscopy and X-ray photoelectron spectroscopy analyses. In addition, we demonstrate that by minimizing the thickness of the surface oxide layer, Cu granular films with good conductivity could be obtained by sintering nanoparticle assembles. Finally, we fabricated highly conductive Cu patterns on a plastic substrate by ink-jet printing.
引用
收藏
页码:679 / 686
页数:8
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