In this paper, a simple method is presented for the fabrication of nickel (Ni) patterns on porous silicon (PS) substrates using a focused and scanned Ar+-laser beam. A commercially available electroless plating bath was operated as a precursor during the laser direct writing process. As a result, thin (t = 40-250 nm), narrow (w = 2-3 mum), uniform and conductive Ni deposits were formed on the surface of the PS. The deposits were characterized by profilometry, FESEM (equipped with EDX), FIB and resistance measurements. (C) 2001 Elsevier Science B,V. All rights reserved.