Interface trap generation by FN injection under dynamic oxide field stress

被引:26
作者
Chen, TP [1 ]
Li, S
Fung, S
Lo, KF
机构
[1] Univ Hong Kong, Dept Phys, Solid State Lab, Hong Kong, Peoples R China
[2] Chartered Semicond Mfg Ltd, Singapore 738406, Singapore
关键词
integrated circuit reliability; MOS devices; MOSFET's; semiconductor device reliability; silicon materials/devices;
D O I
10.1109/16.711356
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Interface trap generation under dynamic (bipolar and unipolar) and de oxide field stress has been investigated with the charge pumping technique. It is observed that regardless of stress type, whether de or dynamic (bipolar or unipolar), and the polarity of stress voltage, interface trap generation starts to occur at the voltage at which Fowler-Nordheim (FN) tunneling through the oxide starts to build up. For positive voltage, interface trap generation is attributed to the recombination of trapped holes with electrons and to the bond breaking by the hydrogen (H and H+) released during stressing. For negative voltage, in addition to these two mechanisms, the bond breaking by energetic electrons may also contribute to interface trap generation. The frequency dependence of interface trap generation is also investigated. Interface trap generation is independent of stressing frequency for unipolar stress but it shows a frequency dependence for bipolar stress.
引用
收藏
页码:1920 / 1926
页数:7
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