Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

被引：201

作者：

Anderson, IE ^{[1
]}

Foley, JC ^{[1
]}

Cook, BA ^{[1
]}

Harringa, J ^{[1
]}

Terpstra, RL ^{[1
]}

Unal, O ^{[1
]}

机构：

[1] Iowa State Univ Sci & Technol, Ames Lab, Ames, IA 50011 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2001年 / 30卷 / 09期

关键词：

Sn-Ag-Cu solder; Sn/Ag eutectic solder; joint microstructure; joint strength; Cu-Sn intermetallics; thermal stability;

D O I：

10.1007/s11664-001-0129-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This study included a comparison of the baseline Sn-3.5Ag eutectic to one near-eutectic ternary alloy, Sn-3.6Ag-1.0Cu and two quaternary alloys, Sn-3.6Ag-1.0Cu-0.15Co and Sn-3.6Ag-1.0Cu-0.45Co, to increase understanding of the beneficial effects of Co on Sn-Ag-Cu solder joints cooled at 1-3 degreesC/sec, typical of reflow practice. The results indicated that joint microstructure refinement is due to Co-enhanced nucleation of the Cu6Sn5 phase in the solder matrix, as suggested by Auger elemental mapping and calorimetric measurements. The Co also reduced intermetallic interface faceting and improved the ability of the solder joint samples to maintain their shear strength after aging for 72 hr at 150 degreesC. The baseline Sn-3.5Ag joints exhibited significantly reduced strength and coarser microstructures.

引用

页码：1050 / 1059

页数：10

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