Electrical properties of carbon nanotube bundles for future via interconnects

被引：144

作者：

Nihei, M

Kawabata, A

Kondo, D

Horibe, M

Sato, S

Awano, Y

机构：

[1] Fujitsu Ltd, Atsugi, Kanagawa 2430197, Japan

[2] Fujitsu Labs Ltd, Nantechnol Res Ctr, Atsugi, Kanagawa 2430197, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2005年 / 44卷 / 4A期

关键词：

carbon nanotube; chemical vapor deposition; via; interconnect; resistance;

D O I：

10.1143/JJAP.44.1626

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes using thermal chemical vapor deposition (CVD) at a growth temperature of 450 degrees C with cobalt catalysts, titanium carbide ohmic contacts, and tantalum barrier layers on copper wiring. The lowest resistance obtained was about 5 Omega/via. The total resistance of the CNT via was three orders of magnitude lower than that of one CNT, indicating that the current flows in parallel through about 1000 tubes. No degradation was observed for 100 hours at via current densities of 2 x 10(6) A/cm(2), which is favorably compared with Cu vias.

引用

页码：1626 / 1628

页数：3

共 12 条

[1]

AWANO Y, 2004, P INT C SOL STAT DEV, P40

[2] Thermal conductivity of single-walled carbon nanotubes [J].

Hone, J ;

Whitney, M ;

Zettl, A .

SYNTHETIC METALS, 1999, 103 (1-3) :2498-2499

[3]

HONELEIN W, 2001, P INT MICR NAN C, P76

[4] HELICAL MICROTUBULES OF GRAPHITIC CARBON [J].

IIJIMA, S .

NATURE, 1991, 354 (6348) :56-58

[5] Carbon nanotube interconnects: A process solution [J].

Jun, L ;

Ye, Q ;

Cassell, A ;

Koehne, J ;

Ng, HT ;

Han, J ;

Meyyappan, M .

PROCEEDINGS OF THE IEEE 2003 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2003, :271-272

[6]

KAWABATA A, 2004, P INT C SCI APPL NAN, P31

[7] Quantum interference and ballistic transmission in nanotube electron waveguides [J].

Kong, J ;

Yenilmez, E ;

Tombler, TW ;

Kim, W ;

Dai, HJ ;

Laughlin, RB ;

Liu, L ;

Jayanthi, CS ;

Wu, SY .

PHYSICAL REVIEW LETTERS, 2001, 87 (10) :1-106801

[8] Carbon nanotube vias for future LSI interconnects [J].

Nihei, M ;

Horibe, M ;

Kawabata, A ;

Awano, Y .

PROCEEDINGS OF THE IEEE 2004 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2004, :251-253

[9] Simultaneous formation of multiwall carbon nanotubes and their end-bonded ohmic contacts to Ti electrodes for future ULSI interconnects [J].

Nihei, M ;

Horibe, M ;

Kawabata, A ;

Awano, Y .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2004, 43 (4B) :1856-1859

[10] Direct diameter-controlled growth of multiwall carbon nanotubes on nickel-silicide layer [J].

Nihei, M ;

Kawabata, A ;

Awano, Y .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2003, 42 (6B) :L721-L723

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