Application of contact angle measurements to lithographic processes

被引：3

作者：

Fadda, E

Clarisse, C

Paniez, PJ

机构：

[1] France Telecom / CNET-Grenoble, F-38243 Meylan Cedex

来源：

MICROELECTRONIC ENGINEERING | 1996年 / 30卷 / 1-4期

关键词：

D O I：

10.1016/0167-9317(95)00317-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The application of the contact angle measurement technique to lithographic processes is investigated through three examples namely, the structure of basic pure Novolak polymers, the monitoring of the latent image of DNQ-Novolak systems and the deprotection of a DUV resist polymer binder. Depending on the importance of the modifications implied, either the dispersive or the basic components of surface energy must he considered.

引用

页码：593 / 596

页数：4

共 13 条

[1]

DAI CM, 1995, P SOC PHOTO-OPT INS, V2438, P709, DOI 10.1117/12.210406

[2]

DAMMEL R, 1993, DIAZONAPHTOQUINON TT, V11

[3] CHARACTERIZATION OF LATENT IMAGE BY SURFACE-ENERGY DETERMINED BY CONTACT-ANGLE MEASUREMENTS [J].

FADDA, E ;

BERENGUER, M ;

CLARISSE, C .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (03) :1055-1057

[4]

FADDA E, 1994, P SOC PHOTO-OPT INS, V2195, P576, DOI 10.1117/12.175371

[5]

Good R.J., 1991, FUNDAMENTALS ADHESIO

[6]

Honda K., 1990, Proceedings of the SPIE - The International Society for Optical Engineering, V1262, P493, DOI 10.1117/12.20104

[7] ADHESION OF PHOTORESIST PATTERN BAKED AT 80 TO 325-DEGREES-C IN TETRAMETHYL-AMMONIUM-HYDROXIDE AQUEOUS-SOLUTION [J].

KAWAI, A ;

NAGATA, H ;

TAKATA, M .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1992, 31 (11) :3725-3730

[8]

Koshiba M., 1988, Proceedings of the SPIE - The International Society for Optical Engineering, V920, P364, DOI 10.1117/12.968337

[9] ACIDITY OF LITHOGRAPHIC MATERIALS - CHARACTERIZATION BY COLORIMETRIC TITRATION [J].

PANIEZ, PJ ;

DEMATTEI, DC ;

ABADIE, MJM .

MICROELECTRONIC ENGINEERING, 1992, 17 (1-4) :279-282

[10]

SCHWALM R, 1994, P SOC PHOTO-OPT INS, V2195, P2, DOI 10.1117/12.175338

← 1 2 →