Growth per cycle in atomic layer deposition: A theoretical model

被引:176
作者
Puurunen, RL [1 ]
机构
[1] Aalto Univ, Lab Ind Chem, FIN-02015 Helsinki, Finland
关键词
D O I
10.1002/cvde.200306265
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Atomic layer deposition (ALD) is used in advanced applications where thin layers of materials with precise thickness down to the nanometer scale are needed. Growth of materials by ALD takes place through repeating the separate, saturating reactions of at least two gaseous reactants with a solid substrate. When surface saturation is systematically utilized, the growth obtained per ALD reaction cycle is a well-defined quantity that depends on i) the reactants used, ii) the ALD processing temperature, and iii) sometimes the substrate material. A model is derived to describe the growth per cycle in ALD as a function of the chemistry of the growth when compounds are used as reactants. Two main types of chemisorption may occur: i) ligand exchange reaction of the MLn reactant with surface "a" groups, where ligands are removed from the surface as gaseous aL, and ii) dissociation or association, where all parts of the MLn, reactant are attached to the surface. A simple mathematical model based on the mass balance of chemisorption relates the growth per cycle to the size of the MLn reactant and the chemisorption mechanisms involved. Steric hindrance of the ligands causes saturation of chemisorption if a limited number of bonding sites does not cause it. Because of the steric hindrance, the growth per cycle remains less than a monolayer. The applicability of the model is illustrated through several theoretical examples.
引用
收藏
页码:249 / 257
页数:9
相关论文
共 27 条
[1]  
ALESKOVSKII VB, 1974, ZH PRIKL KHIM, V47, P2145
[2]   Modelling of ZrO2 deposition from ZrCl4 and H2O the Si(100) surface:: initial reactions and surface structures [J].
Brodskii, VV ;
Rykova, EA ;
Bagatur'yants, AA ;
Korkin, AA .
COMPUTATIONAL MATERIALS SCIENCE, 2002, 24 (1-2) :278-283
[3]   Surface chemistry for atomic layer growth [J].
George, SM ;
Ott, AW ;
Klaus, JW .
JOURNAL OF PHYSICAL CHEMISTRY, 1996, 100 (31) :13121-13131
[4]   Modeling and simulation of atomic layer deposition at the feature scale [J].
Gobbert, MK ;
Prasad, V ;
Cale, TS .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (03) :1031-1043
[5]   ATOMIC LAYER EPITAXY [J].
GOODMAN, CHL ;
PESSA, MV .
JOURNAL OF APPLIED PHYSICS, 1986, 60 (03) :R65-R81
[6]   Nucleation and growth of atomic layer deposited HfO2 gate dielectric layers on chemical oxide (Si-O-H) and thermal oxide (SiO2 or Si-O-N) underlayers [J].
Green, ML ;
Ho, MY ;
Busch, B ;
Wilk, GD ;
Sorsch, T ;
Conard, T ;
Brijs, B ;
Vandervorst, W ;
Räisänen, PI ;
Muller, D ;
Bude, M ;
Grazul, J .
JOURNAL OF APPLIED PHYSICS, 2002, 92 (12) :7168-7174
[7]   Growth mechanisms of mixed oxides on alumina [J].
Haukka, S ;
Lindblad, M ;
Suntola, T .
APPLIED SURFACE SCIENCE, 1997, 112 :23-29
[8]  
Haukka S, 1999, STUD SURF SCI CATAL, V120, P715
[9]   THEORETICAL-STUDIES ON THE GROWTH MECHANISMS OF SILICON THIN-FILMS BY ATOMIC LAYER EPITAXY [J].
HIRVA, P ;
PAKKANEN, TA .
SURFACE SCIENCE, 1989, 220 (01) :137-151
[10]   Mechanism of atomic layer deposition of SiO2 on the silicon (100)-2x1 surface using SiCl4 and H2O as precursors [J].
Kang, JK ;
Musgrave, CB .
JOURNAL OF APPLIED PHYSICS, 2002, 91 (05) :3408-3414