Curving monolithic silicon for nonplanar focal plane array applications

被引:96
作者
Dinyari, Rostam [1 ]
Rim, Seung-Bum [1 ]
Huang, Kevin [1 ]
Catrysse, Peter B. [1 ]
Peumans, Peter [1 ]
机构
[1] Stanford Univ, Dept Elect Engn, Stanford, CA 94305 USA
关键词
D O I
10.1063/1.2883873
中图分类号
O59 [应用物理学];
学科分类号
摘要
Despite progress in the performance of image sensors, comparatively little work has focused on overcoming the limitations of planar image sensor arrays. We present a technique to construct curved monolithic silicon structures that can be processed using standard silicon processing prior to curving. The process relies on microstructuring of a monolithic silicon die using a deep reactive ion etch process. This technique can be used to build curved integrated circuits such as image sensors for more compact cameras with improved optical performance. (C) 2008 American Institute of Physics.
引用
收藏
页数:3
相关论文
共 15 条
[1]   Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon [J].
Ahn, Jong-Hyun ;
Kim, Hoon-Sik ;
Menard, Etienne ;
Lee, Keon Jae ;
Zhu, Zhengtao ;
Kim, Dae-Hyeong ;
Nuzzo, Ralph G. ;
Rogers, John A. .
APPLIED PHYSICS LETTERS, 2007, 90 (21)
[2]   AN ABUTTABLE CCD IMAGER FOR VISIBLE AND X-RAY FOCAL PLANE ARRAYS [J].
BURKE, BE ;
MOUNTAIN, RW ;
HARRISON, DC ;
BAUTZ, MW ;
DOTY, JP ;
RICKER, GR ;
DANIELS, PJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1991, 38 (05) :1069-1076
[3]  
HUANG K, 2007, P INT EL DEV M DEC 1, P217
[4]   Microfabricated suspensions for electrical connections on the tunable elastomer membrane [J].
Hung, PJ ;
Jeong, KH ;
Liu, GL ;
Lee, LP .
APPLIED PHYSICS LETTERS, 2004, 85 (24) :6051-6053
[5]  
*IMAGEEVAL CONS, 2004, ISET DIG CAM SIM VER
[6]   Soft lithographic fabrication of an image sensor array on a curved substrate [J].
Jin, HC ;
Abelson, JR ;
Erhardt, MK ;
Nuzzo, RG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2004, 22 (05) :2548-2551
[7]   Bulk micromachining of silicon [J].
Kovacs, GTA ;
Maluf, NI ;
Petersen, KE .
PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1536-1551
[8]   Design and performance of thin metal film interconnects for skin-like electronic circuits [J].
Lacour, SP ;
Jones, J ;
Suo, Z ;
Wagner, S .
IEEE ELECTRON DEVICE LETTERS, 2004, 25 (04) :179-181
[9]  
LOWENTHAL H, Patent No. 2645157
[10]   Mechanically flexible thin-film transistors that use ultrathin ribbons of silicon derived from bulk wafers [J].
Mack, S. ;
Meitl, M. A. ;
Baca, A. J. ;
Zhu, Z. -T. ;
Rogers, J. A. .
APPLIED PHYSICS LETTERS, 2006, 88 (21)