Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters-A Review

被引:502
作者
Avenas, Yvan [1 ]
Dupont, Laurent [2 ]
Khatir, Zoubir [2 ]
机构
[1] Univ Grenoble, Grenoble Elect Engn Lab, F-38402 St Martin Dheres, France
[2] French Inst Sci & Technol Transport Dev & Network, Lab New Technol, F-78000 Versailles, France
关键词
Chip temperature; power electronics; semiconductor devices; thermo-sensitive electrical parameter (TSEP); TRANSIENT JUNCTION TEMPERATURE; THERMAL CHARACTERIZATION; CHANNEL TEMPERATURE; MODULES; MODEL; PERFORMANCE; MANAGEMENT; LIFETIME; MOSFET;
D O I
10.1109/TPEL.2011.2178433
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];
摘要
This paper proposes a synthesis of different electrical methods used to estimate the temperature of power semiconductor devices. The following measurement methods are introduced: the voltage under low current levels, the threshold voltage, the voltage under high current levels, the gate-emitter voltage, the saturation current, and the switching times. All these methods are then compared in terms of sensitivity, linearity, accuracy, genericity, calibration needs, and possibility of characterizing the thermal impedance or the temperature during the operation of the converter. The measurement of thermo-sensitive parameters of wide bandgap semiconductors is also discussed.
引用
收藏
页码:3081 / 3092
页数:12
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