Stereological properties of the intermetallic formed at the nickel-liquid tin interface

被引：5

作者：

deAvillez, RR

Lopes, MFS

Silva, ALM

机构：

[1] Depto. Cie. Materiais e Metalurgia, Pont. Universidade Católica

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1996年 / 205卷 / 1-2期

关键词：

stereological properties; intermetallics; nickel; tin;

D O I：

10.1016/0921-5093(95)09870-4

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The profile roughness and the profile configuration parameters. two stereological properties developed for fracture surfaces, are employed to characterize the evolution of the intermetallic- liquid tin interface present during the soldering process between nickel and tin. It is shown that they provide a useful description of the intermetallic-liquid tin interface. A geometric model is proposed for this interface and found to be valid for the whole range of soldering time and geometric scaling.

引用

页码：209 / 213

页数：5

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