Chemical mechanical planarization of copper: pH effect

被引：17

作者：

Du, T ^{[1
]}

Desai, V ^{[1
]}

机构：

[1] Univ Cent Florida, Adv Mat Proc & Anal Ctr, Orlando, FL 32826 USA

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 2003年 / 22卷 / 22期

关键词：

D O I：

10.1023/A:1026353028626

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The effect of pH and H2O2 on the etching and polishing behavior of copper was studied. The copper surface morphology formed in pH 4 and 6 solution was observed. It was concluded that the chemical mechanical polishing removal rates and etch rates of copper in slurries with 5% H2O2 were found to vary with pH.

引用

页码：1623 / 1625

页数：3

共 11 条

[1] INITIAL STUDY ON COPPER CMP SLURRY CHEMISTRIES [J].

CARPIO, R ;

FARKAS, J ;

JAIRATH, R .

THIN SOLID FILMS, 1995, 266 (02) :238-244

[2]

DESAI V, 2002, P 5 INT S CHEM MECH

[3] INITIAL AND FINAL-STATE EFFECTS IN ESCA SPECTRA OF CADMIUM AND SILVER-OXIDES [J].

GAARENSTROOM, SW ;

WINOGRAD, N .

JOURNAL OF CHEMICAL PHYSICS, 1977, 67 (08) :3500-3506

[4] Chemical-mechanical polishing of copper with oxide and polymer interlevel dielectrics [J].

Gutmann, RJ ;

Steigerwald, JM ;

You, L ;

Price, DT ;

Neirynck, J ;

Duquette, DJ ;

Murarka, SP .

THIN SOLID FILMS, 1995, 270 (1-2) :596-600

[5] COPPER INTERCONNECTION INTEGRATION AND RELIABILITY [J].

HU, CK ;

LUTHER, B ;

KAUFMAN, FB ;

HUMMEL, J ;

UZOH, C ;

PEARSON, DJ .

THIN SOLID FILMS, 1995, 262 (1-2) :84-92

[6] CONTACT AND VIA STRUCTURES WITH COPPER INTERCONNECTS FABRICATED USING DUAL DAMASCENE TECHNOLOGY [J].

LAKSHMINARAYANAN, S ;

STEIGERWALD, J ;

PRICE, DT ;

BOURGEOIS, M ;

CHOW, TP ;

GUTMANN, RJ ;

MURARKA, SP .

IEEE ELECTRON DEVICE LETTERS, 1994, 15 (08) :307-309

[7] Influence of oxides on friction during CuCMP [J].

Liang, H ;

Martin, JM ;

Lee, R .

JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (04) :391-395

[8] Stabilization of alumina slurry for chemical-mechanical polishing of copper [J].

Luo, Q ;

Campbell, DR ;

Babu, SV .

LANGMUIR, 1996, 12 (15) :3563-3566

[9] CHEMICAL INFORMATION FROM XPS - APPLICATIONS TO THE ANALYSIS OF ELECTRODE SURFACES [J].

MCINTYRE, NS ;

SUNDER, S ;

SHOESMITH, DW ;

STANCHELL, FW .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 18 (03) :714-721

[10] CHEMICAL-MECHANICAL POLISHING OF COPPER FOR MULTILEVEL METALLIZATION [J].

STAVREVA, Z ;

ZEIDLER, D ;

PLOTNER, M ;

DRESCHER, K .

APPLIED SURFACE SCIENCE, 1995, 91 (1-4) :192-196

← 1 2 →