Combined deposition and implantation in the cathodic arc for thick film preparation

被引：35

作者：

Tarrant, RN ^{[1
]}

Montross, CS ^{[1
]}

McKenzie, DR ^{[1
]}

机构：

[1] Univ Sydney, Sch Phys, Sydney, NSW 2006, Australia

来源：

SURFACE & COATINGS TECHNOLOGY | 2001年 / 136卷 / 1-3期

关键词：

filtered cathodic arc; ion implantation; delamination; compressive film stress; micro-indentation; glassy carbon;

D O I：

10.1016/S0257-8972(00)01052-5

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Delamination is a major mode of failure for many thin films. A film may delaminate spontaneously if the strain energy released exceeds the adhesion energy per unit area. In this work we explore the use of pulsed ion bombardments with energies up to 20 keV. At this energy, which is much higher than that normally used in ion-assisted deposition, implantation into the underlying substrate will occur. The process may have beneficial effects on the film adhesion. We report that we have successfully prepared carbon films in excess of 4.5 mum in thickness on silicon substrates. The thick films demonstrate indentation properties similar to bulk glassy carbon. In addition, we have been able to modify the stoichiometry of films by using a combination of implantation and deposition. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：188 / 191

页数：4

共 12 条

[1] ADHERENT CARBON-FILM DEPOSITION BY CATHODIC ARC WITH IMPLANTATION [J].