High-dielectric-constant silver-epoxy composites as embedded dielectrics

被引：398

作者：

Qi, L

Lee, BI ^{[1
]}

Chen, SH

Samuels, WD

Exarhos, GJ

机构：

[1] Clemson Univ, Sch Mat Sci & Engn, Clemson, SC 29634 USA

[2] Duke Univ, Dept Biomed Engn, Durham, NC 27708 USA

[3] Pacific NW Natl Lab, Dept Mat Sci, Richland, WA 99352 USA

来源：

ADVANCED MATERIALS | 2005年 / 17卷 / 14期

关键词：

D O I：

10.1002/adma.200401816

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

The incorporation of organic-coated silver nanoparticles into an epoxy matrix (see Figure, a-f represent increasing Ag content) results in a flexible 0-3 type nanocomposite with a strikingly high dielectric constant (greater than 300). The composite retains the flexibility and other mechanical properties of the polymer matrix, and may be useful in applications where capacitors are embedded into printed circuit boards.

引用

页码：1777 / +

页数：6

共 25 条

[11] Single-phase and gram-scale routes toward nearly monodisperse Au and other noble metal nanocrystals [J].

Jana, NR ;

Peng, XG .

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2003, 125 (47) :14280-14281

[12] PERCOLATION AND CONDUCTION [J].

KIRKPATRICK, S .

REVIEWS OF MODERN PHYSICS, 1973, 45 (04) :574-588

[13] PHYSICS OF INHOMOGENEOUS INORGANIC MATERIALS [J].

NAN, CW .

PROGRESS IN MATERIALS SCIENCE, 1993, 37 (01) :1-116

[14] Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors [J].

Ogitani, S ;

Bidstrup-Allen, SA ;

Kohl, PA .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02) :313-322

[15]

Pecharromán C, 2001, ADV MATER, V13, P1541, DOI 10.1002/1521-4095(200110)13:20<1541::AID-ADMA1541>3.0.CO

[16]

2-X

[17]

Pecharromán C, 2000, ADV MATER, V12, P294, DOI 10.1002/(SICI)1521-4095(200002)12:4<294::AID-ADMA294>3.0.CO

[18]

2-D

[19] Dielectric properties of polymer/ferroelectric ceramic composites from 100 Hz to 10 GHz [J].

Popielarz, R ;

Chiang, CK ;

Nozaki, R ;

Obrzut, J .

MACROMOLECULES, 2001, 34 (17) :5910-5915

[20] Ultra high dielectric constant epoxy silver composite for embedded capacitor application [J].

Rao, Y ;

Wong, CP .

52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, :920-923

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