CMOS foundry-based micromachining

被引：17

作者：

Tilmans, HAC ^{[1
]}

Baert, K ^{[1
]}

Verbist, A ^{[1
]}

Puers, R ^{[1
]}

机构：

[1] IMEC VZW,DIVISIE MAP,B-3001 HEVERLEE,BELGIUM

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1996年 / 6卷 / 01期

关键词：

D O I：

10.1088/0960-1317/6/1/030

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports on the first results of a study of the possibilities of the fabrication of micromechanical structures for microsystems applications in a regular MPC run of a standard CMOS process, followed by post-processing. Two post-processing modules, i.e., the frontside bulk etching module and the surface micromachining module are investigated. Examples of the former are suspended spiral coils for high-frequency applications and of the latter, metal bridge resonators.

引用

页码：122 / 127

页数：6

共 17 条

[1] CMOS AS SENSOR TECHNOLOGY [J].