Plasma characterization in chlorine-based reactive ion beam etching and chemically assisted ion beam etching

被引:9
作者
Matsutani, A [1 ]
Koyama, F [1 ]
Iga, K [1 ]
机构
[1] Tokyo Inst Technol, Precis & Intelligence Lab, Midori Ku, Yokohama, Kanagawa 2268503, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1998年 / 37卷 / 5A期
关键词
reactive ion beam etching; chemically assisted ion beam etching; appearance mass spectrometry; ion energy;
D O I
10.1143/JJAP.37.2747
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:2747 / 2751
页数:5
相关论文
共 8 条
[1]   GAAS AND ALGAAS ANISOTROPIC FINE PATTERN ETCHING USING A NEW REACTIVE ION-BEAM ETCHING SYSTEM [J].
ASAKAWA, K ;
SUGATA, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1985, 3 (01) :402-405
[2]   INVESTIGATION OF CHEMICALLY ASSISTED ION-BEAM ETCHING FOR THE FABRICATION OF VERTICAL, ULTRAHIGH QUALITY FACETS IN GAAS [J].
HAGBERG, M ;
JONSSON, B ;
LARSSON, AG .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (02) :555-566
[3]   CHEMICALLY ETCHED-MIRROR GALNASP/INP LASERS - REVIEW [J].
IGA, K ;
MILLER, BI .
IEEE JOURNAL OF QUANTUM ELECTRONICS, 1982, 18 (01) :22-29
[4]  
MATSUTANI A, 1993, MATER SCI FORUM, V140, P641
[5]   LOW-THRESHOLD MESA-ETCHED VERTICAL-CAVITY INGAAS/GAAS SURFACE-EMITTING LASERS GROWN BY MOCVD [J].
MUKAIHARA, T ;
HAYASHI, Y ;
HATORI, N ;
OHNOKI, N ;
MATSUTANI, A ;
KOYAMA, F ;
IGA, K .
ELECTRONICS LETTERS, 1995, 31 (08) :647-648
[6]   APPEARANCE MASS-SPECTROMETRY OF NEUTRAL RADICALS IN RADIO-FREQUENCY PLASMAS [J].
SUGAI, H ;
TOYODA, H .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (04) :1193-1200
[7]   SMOOTH AND VERTICAL INP REACTIVE ION-BEAM ETCHING WITH CL2 ECR PLASMA [J].
YOSHIKAWA, T ;
KOHMOTO, S ;
OZAKI, M ;
HAMAO, N ;
SUGIMOTO, Y ;
SUGIMOTO, M ;
ASAKAWA, K .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1992, 31 (5B) :L655-L657
[8]   CHARACTERIZATION OF CHEMICALLY ASSISTED ION-BEAM ETCHING OF INP [J].
YOUTSEY, C ;
GRUNDBACHER, R ;
PANEPUCCI, R ;
ADESIDA, I ;
CANEAU, C .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06) :3317-3321