Effect of polycrystalline-silicon gate types on the opposite flatband voltage shift in n-type and p-type metal-oxide-semiconductor field-effect transistors for high-k-HfO2 dielectric

被引:36
作者
Yang, CW
Fang, YK
Chen, CH
Chen, SF
Lin, CY
Lin, CS
Wang, MF
Lin, YM
Hou, TH
Chen, CH
Yao, LG
Chen, SC
Liang, MS
机构
[1] Natl Cheng Kung Univ, Dept Elect Engn, Inst Microelect, VLSI Technol Lab, Tainan 70101, Taiwan
[2] Taiwan Semicond Mfg Co Ltd, Hsinchu, Taiwan
关键词
D O I
10.1063/1.1592634
中图分类号
O59 [应用物理学];
学科分类号
摘要
Hafnium dioxide (HfO2) gate dielectrics formed by the atomic layer deposition (ALD) process were fabricated to investigate the flatband voltage shift (DeltaV(FB)) relative to SiO2. It is found that the direction of DeltaV(FB) depends on the Fermi level position in the gate material, which shows respective positive and negative shifts in n-type and p-type metal-oxide-semiconductor field-effect transistors (MOSFETs), regardless of the substrate type. The opposite direction in the flatband voltage shift is attributed to both acceptor- and donor-like interface states existing at the interface between the polycrystalline-silicon (poly-Si) gate and HfO2 dielectric. A model is proposed to explain the effects of poly-Si gate type on the flatband voltage shift in MOSFETs. (C) 2003 American Institute of Physics.
引用
收藏
页码:308 / 310
页数:3
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