Autonomic Restoration of Electrical Conductivity

被引:269
作者
Blaiszik, Benjamin J. [1 ]
Kramer, Sharlotte L. B. [1 ]
Grady, Martha E. [2 ]
McIlroy, David A. [1 ]
Moore, Jeffrey S. [3 ]
Sottos, Nancy R. [1 ]
White, Scott R. [4 ]
机构
[1] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[2] Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA
[3] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61801 USA
[4] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Aerosp Engn, Urbana, IL 61801 USA
关键词
stimuli-responsive materials; self-healing materials; microelectronics; electrical conductivity; SELF-HEALING MATERIALS; GALLIUM-INDIUM EGAIN; LIQUID-METAL; INTEGRATION; CIRCUITS; FAILURE; ALLOY;
D O I
10.1002/adma.201102888
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Self-healing of an electrical circuit is demonstrated with nearly full recovery of conductance less than one millisecond after damage. Crack damage breaks a conductive pathway in a multilayer device, interrupting electron transport and simultaneously rupturing adjacent microcapsules containing gallium-indium liquid metal (top). The released liquid metal flows to the area of damage, restoring the conductive pathway (bottom).
引用
收藏
页码:398 / +
页数:5
相关论文
共 26 条
[1]   Cracking in thin multi-layers with finite-width and periodic architectures [J].
Ambrico, JM ;
Jones, EE ;
Begley, MR .
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2002, 39 (06) :1443-1462
[2]   Nanocapsules for self-healing materials [J].
Blaiszik, B. J. ;
Sottos, N. R. ;
White, S. R. .
COMPOSITES SCIENCE AND TECHNOLOGY, 2008, 68 (3-4) :978-986
[3]   In situ poly(urea-formaldehyde) microencapsulation of dicyclopentadiene [J].
Brown, EN ;
Kessler, MR ;
Sottos, NR ;
White, SR .
JOURNAL OF MICROENCAPSULATION, 2003, 20 (06) :719-730
[4]   Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling [J].
Cale, Timothy S. ;
Lu, Jian-Qiang ;
Gutmann, Ronald J. .
CHEMICAL ENGINEERING COMMUNICATIONS, 2008, 195 (08) :847-888
[5]   Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates [J].
Cao, Qing ;
Kim, Hoon-sik ;
Pimparkar, Ninad ;
Kulkarni, Jaydeep P. ;
Wang, Congjun ;
Shim, Moonsub ;
Roy, Kaushik ;
Alam, Muhammad A. ;
Rogers, John A. .
NATURE, 2008, 454 (7203) :495-U4
[6]   Microcapsules containing suspensions of carbon nanotubes [J].
Caruso, Mary M. ;
Schelkopf, Stuart R. ;
Jackson, Aaron C. ;
Landry, Alexandra M. ;
Braun, Paul V. ;
Moore, Jeffrey S. .
JOURNAL OF MATERIALS CHEMISTRY, 2009, 19 (34) :6093-6096
[7]   Failure mechanisms of solder interconnects under current stressing in advanced electronic packages [J].
Chan, Y. C. ;
Yang, D. .
PROGRESS IN MATERIALS SCIENCE, 2010, 55 (05) :428-475
[8]   Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints [J].
Chen, Chih ;
Tong, H. M. ;
Tu, K. N. .
ANNUAL REVIEW OF MATERIALS RESEARCH, VOL 40, 2010, 40 :531-555
[9]   Eutectic gallium-indium (EGaIn): A moldable liquid metal for electrical characterization of self-assembled monolayers [J].
Chiechi, Ryan C. ;
Weiss, Emily A. ;
Dickey, Michael D. ;
Whitesides, George M. .
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION, 2008, 47 (01) :142-144
[10]   Adhesion and debonding of multi-layer thin film structures [J].
Dauskardt, R ;
Lane, M ;
Ma, Q ;
Krishna, N .
ENGINEERING FRACTURE MECHANICS, 1998, 61 (01) :141-162