Unique phase changes induced by electromigration (EM) in solder joints

被引：5

作者：

Gan, H ^{[1
]}

Xu, G ^{[1
]}

Tu, KN ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS | 2003年

关键词：

D O I：

10.1109/ECTC.2003.1216259

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Electromigration has been a key and persistent reliability problem in microelectronic technology. It involves both atomic flux and electron flux whose distribution in interconnects is most important concerning electromigration damage. Comparing with Al and Cu interconnects, eutectic solders are two-phase alloys with higher atomic diffusivity. In this article, the unique features of solder joints electromigration will be discussed with emphasis on the effects of current crowding, eutectic composition, polarity effect on chemical reaction and solder composition.

引用

页码：71 / 76

页数：6

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