Electromigration in solder joints and solder lines

被引：58

作者：

Gan, H ^{[1
]}

Choi, WJ ^{[1
]}

Xu, G ^{[1
]}

Tu, KN ^{[1
]}

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90095 USA

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 2002年 / 54卷 / 06期

关键词：

Solder Joint; Solder Bump; Cathode Side; Anode Side; Back Stress;

D O I：

10.1007/BF02701847

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Electromigration may affect the reliability of flip-chip solder Joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that ill aluminum or copper interconnects. In addition, a flip-chip solder-joint has a built-in current-crowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-groove etched oil Si (001). This article discusses the results of those tests and compares the electromigration failure modes of eutectic SnPb and SnAgCu flip-chip solder joints along with the mean-time-to-failure.

引用

页码：34 / 37

页数：4

共 16 条

[1] STRESS GENERATION BY ELECTROMIGRATION [J].

BLECH, IA ;

HERRING, C .

APPLIED PHYSICS LETTERS, 1976, 29 (03) :131-133

[2]

BRANDENBURG S, 1998, P SURF MOUNT INT C E, P337

[3]

CHOI WJ, 2002, IN PRESS 2002 IEEE E

[4]

GAN H, 2002, IN PRESS 2002 IEEE E

[5]

GU X, 2001, THESIS UCLA

[6] Interface diffusion in eutectic Pb-Sn solder [J].

Gupta, D ;

Vieregge, K ;

Gust, W .

ACTA MATERIALIA, 1998, 47 (01) :5-12

[7]

HUNTINGTON HB, 1961, DIFFUSION SOLIDS REC, P303

[8] Electromigration in eutectic SnPb solder lines [J].

Huynh, QT ;

Liu, CY ;

Chen, C ;

Tu, KN .

JOURNAL OF APPLIED PHYSICS, 2001, 89 (08) :4332-4335

[9] Electromigration of eutectic SnPb solder interconnects for flip chip technology [J].

Lee, TY ;

Tu, KN ;

Kuo, SM ;

Frear, DR .

JOURNAL OF APPLIED PHYSICS, 2001, 89 (06) :3189-3194

[10] Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization [J].

Lee, TY ;

Tu, KN ;

Frear, DR .

JOURNAL OF APPLIED PHYSICS, 2001, 90 (09) :4502-4508

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