Snapping microswitches with adjustable acceleration threshold

被引:78
作者
Go, JS
Cho, YH
Kwak, BM
Park, K
机构
[1] KOREA ADV INST SCI & TECHNOL,DEPT MECH ENGN,YUSONG KU,TAEJON 305701,SOUTH KOREA
[2] HYUNDAI MOTOR CO,DEPT RES & DEV,KYUNGGI 445850,SOUTH KOREA
关键词
acceleration switches; bimorphs; microswitches;
D O I
10.1016/S0924-4247(97)80018-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the design, fabrication and testing of prestressed bimorph microbeams for applications to tunable acceleration switches. The prestressed bimorph beams are buckled due to the residual stress difference between two dissimilar films, thereby generating initial beam deflections upon fabrication. Necessary and sufficient conditions for snapping action of the deflected bimorph beam have been derived from snap-through buckling analysis. A set of SiO2/p(+)-silicon bimorph beams has been designed and fabricated in three different lengths, 800, 900 and 1000 mu m. The electrostatic snap-through voltage for each microbeam has been measured as 32, 56.3 and 76.5 V, respectively. Micromechanical properties of beam materials have been measured from on-chip test structures. It is demonstrated that the three different microswitches with a 7 mu g proof-mass can be applicable to acceleration switches, where threshold acceleration levels can be adjustable within the ranges 0-14, 0-35 and 0-47 g, respectively, under inter-electrode bias voltages of 0-76 V.
引用
收藏
页码:579 / 583
页数:5
相关论文
共 14 条
[1]   A TECHNIQUE FOR THE DETERMINATION OF STRESS IN THIN-FILMS [J].
BROMLEY, EI ;
RANDALL, JN ;
FLANDERS, DC ;
MOUNTAIN, RW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (04) :1364-1366
[2]   MICROMINIATURE GANGED THRESHOLD ACCELEROMETERS COMPATIBLE WITH INTEGRATED-CIRCUIT TECHNOLOGY [J].
FROBENIUS, WD ;
WHITE, MH ;
ZEITMAN, SA ;
OSULLIVA.DD ;
HAMEL, RG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1972, ED19 (01) :37-+
[3]  
Halg B., 1990, Proceedings. IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (Cat. No.90CH2832-4), P172, DOI 10.1109/MEMSYS.1990.110271
[4]  
Judy M. W., 1991, Proceedings. IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots (Cat. No.91CH2957-9), P51, DOI 10.1109/MEMSYS.1991.114768
[5]   LOCAL STRESS MEASUREMENT IN THIN THERMAL SIO2 FILMS ON SI-SUBSTRATES [J].
LIN, SCH ;
PUGACZMU.I .
JOURNAL OF APPLIED PHYSICS, 1972, 43 (01) :119-&
[6]  
Lisec T., 1994, Proceedings IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems (Cat. No.94CH3404-1), P13, DOI 10.1109/MEMSYS.1994.555590
[7]  
Matoba H., 1994, Proceedings IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems (Cat. No.94CH3404-1), P45, DOI 10.1109/MEMSYS.1994.555596
[8]  
*MIN TRAD IND RES, 1994, DEV EL SINGL POINT S
[9]  
NING TH, 1988, PROPERTIES SILICON, P654
[10]   MECHANICAL-PROPERTIES OF THIN-FILMS [J].
NIX, WD .
METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1989, 20 (11) :2217-2245