Superconformal electrodeposition in submicron features

被引：153

作者：

Josell, D ^{[1
]}

Wheeler, D ^{[1
]}

Huber, WH ^{[1
]}

Moffat, TP ^{[1
]}

机构：

[1] Natl Inst Stand & Technol, Gaithersburg, MD 20899 USA

来源：

PHYSICAL REVIEW LETTERS | 2001年 / 87卷 / 01期

关键词：

D O I：

10.1103/PhysRevLett.87.016102

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local coverage in fine features changes more due to interface area change than by accumulation from the electrolyte, yielding superconformal growth. The model is supported by experiments and simulations of copper deposition in 350-100 nm wide features, helping to explain the influence of adsorbates on roughness evolution.

引用

页码：1 / 016102

页数：4

共 10 条

[1] Damascene copper electroplating for chip interconnections [J].