Characterization of the silicon nitride-thermal oxide interface in oxide-nitride-oxide structures by ELS, XPS, ellipsometry, and numerical simulation

被引:11
作者
Gritsenko, VA
Svitasheva, SN
Petrenko, IP
Novikov, YN
Morokov, YN
Wong, H
Kwok, RWM
Chan, RWM
机构
[1] City Univ Hong Kong, Dept Elect Engn, Kowloon, Hong Kong
[2] Russian Acad Sci, Inst Semicond Phys, Novosibirsk 630090, Russia
[3] Inst Computat Technol, Novosibirsk 630090, Russia
[4] Chinese Univ Hong Kong, Shatin, NT, Hong Kong
来源
MICROELECTRONICS AND RELIABILITY | 1998年 / 38卷 / 05期
关键词
silicon oxide nitride interface; XPS; ELS; ellipsometry;
D O I
10.1016/S0026-2714(98)00019-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work studies the properties of the SiO2-Si3N4 interface in oxide-nitride-oxide (ONO) structures by using energy loss spectroscopy, X-ray photoelectron spectroscopy, ellipsometry measurements and numerical simulation. By oxidation the as-deposited Si3N4, silicon-silicon bonds at Si3N4-thermal SiO2 interface are found. These excess Si-Si bonds are produced by replacing nitrogen with oxygen during the oxidation of Si3N4. We further propose that the Si-Si bonds are the major trap center at the Si3N4-SiO2 interface. With MINDO/3 numerical simulation, we have found that the Si-Si bonds can capture both electrons and holes at the top Si3N4-SiO2 interface. These bonds are proposed to be the responsible candidate for the positive charge accumulation in re-oxidized nitrided oxide. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:745 / 751
页数:7
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